{"id":2548,"date":"2026-06-01T09:14:59","date_gmt":"2026-06-01T01:14:59","guid":{"rendered":"http:\/\/walleglobal.com\/?post_type=products&p=2548"},"modified":"2026-07-01T17:41:29","modified_gmt":"2026-07-01T09:41:29","slug":"bestfluor-3275","status":"publish","type":"products","link":"https:\/\/walleglobal.com\/de\/products\/bestfluor-3275\/","title":{"rendered":"Bestfluor 3275"},"content":{"rendered":"
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High Temperature Code<\/h2>\n<\/div>\n\n\n\n
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Available for custom fabrication in black, white and blue<\/p>\n<\/div>\n<\/div><\/div>\n\n\n\n

High Temperature Code<\/td>Bestfluor\u00ae 3275<\/td><\/tr>
Hardness<\/td>75~90<\/td><\/tr>
Temperature Range<\/td>-15\u00b0C ~ +315\u00b0C<\/td><\/tr>
Bestfluor\u00ae 3275 is a black, low compression set perfluoroelastomer (FFKM) designed for dry and wet semiconductor process environments. It features excellent chemical resistance, good mechanical properties and outstanding thermal stability, with low weight loss in reactive plasmas and good resistance to thermal cycling. Not recommended for amine environments. Ultrapure post-cleaning and clean packaging are available as options.<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n
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Kontaktieren Sie uns<\/a><\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n
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Application Range<\/strong><\/div>
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  • Semiconductor dry processes<\/strong>: Seals for plasma processes, deposition, etching equipment<\/li>\n\n\n\n
  • Semiconductor wet processes<\/strong>: Seals for cleaning, etching, photoresist stripping, and high-purity chemical delivery<\/li>\n\n\n\n
  • Ultrapure fluid systems<\/strong>: Seals for high-purity water, strong acids, oxidants, and organic solvent lines<\/li>\n\n\n\n
  • High-temperature sealing<\/strong>: O-rings and custom seals for high-temperature & thermal cycling in semiconductor tools<\/li>\n<\/ul>\n<\/div><\/div>\n<\/div><\/div>\n\n\n\n
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    Characteristics<\/strong><\/strong><\/div>
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    1. Key Physical Properties<\/strong><\/strong><\/h3>\n\n\n\n
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    • Color: black, white and blue; Shore A hardness: 75~90<\/li>\n\n\n\n
    • Tensile strength: 16.88MPa; Elongation at break: 150%<\/li>\n\n\n\n
    • Max continuous service temperature: 315\u00b0C<\/strong>, short-term higher temperature exposure allowed<\/li>\n\n\n\n
    • Compression set: 25% at 204\u00b0C\/70h; remains low (45%) even at 300\u00b0C<\/li>\n<\/ul>\n\n\n\n

      2. Semiconductor-Specific Advantages<\/strong><\/strong><\/h3>\n\n\n\n
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      • Low weight loss<\/strong> in reactive plasma, minimal particle contamination<\/li>\n\n\n\n
      • Excellent resistance to semiconductor chemistries: Piranha, SC-1\/SC-2, HF, H\u2082SO\u2084, HNO\u2083, NMP, etc., with extremely low volume swell<\/li>\n\n\n\n
      • Stable performance under thermal cycling for long-term sealing<\/li>\n<\/ul>\n<\/div><\/div>\n<\/div><\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n
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